Norsk Titanium Announces Full Rate Production Order in the Semiconductor Market
Plattsburgh, New York, 4 June 2024: Norsk Titanium (Euronext: NTI, OTCQX: NORSF), a global leader in additive manufacturing for aerospace-grade structural titanium components using its patented Rapid Plasma Deposition® (RPD®) technology, has received an additional production contract for silicon wafer carrier trays from Hittech Bicha B.V. in the Netherlands, for use in the end-customer ASML semiconductor chipmaking equipment.
Norsk Titanium has been collaborating with its partner, Hittech Group, to produce this part for ASML since early 2023. This latest order is the third production order from this customer to date, highlighting that this part has now transitioned into full rate production.
"We have grown from a technology development company to an industrial scale manufacturer, and expect to deliver over 13 metric tons of additively manufactured titanium to this customer alone in 2024âÂÂ, said Nicholas Mayer, Norsk Titanium VP Commercial.
Each of these carrier trays weigh approximately 90 kilograms today and takes about two days to print, and our technology offers significant saving of raw material and energy as compared to legacy manufacturing methods, adds Mayer.
Norsk Titanium has recently announced qualification and production milestones in their core commercial aerospace and defense markets. The continued expansion of the industrial and semiconductor market offerings is a third pillar in the company growth strategy and is expected to contribute approximately 15% of total revenue this year.
For more information, please contact:
Nicholas Mayer, Vice President Commercial, Norsk Titanium
Email: nicholas.mayer@norsktitanium.com
Tel: +1 518 324 4010